Guo Receives Top Paper Award in Electronic Packaging and Systems

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Dan Watson
dwatson@ece.gatech.edu

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EPEPS is the premier international conference on advanced and emerging issues in electrical modeling, analysis and design of electronic interconnections, packages, and systems.

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  • Ph.D. candidate Yiliang Guo Ph.D. candidate Yiliang Guo
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Ph.D. candidate Yiliang Guo has received the Best Student Paper Award at the 2022 Electrical Performance of Electronic Packaging and Systems Conference (EPEPS 2022).

Guo is a graduate researcher in Georgia Tech’s 3D Systems Packaging Research Center (PRC), a leading academic center focused on advanced packaging and system integration leading to System on Package (SoP) technologies. He is advised by Professor Madhavan Swaminathan in the School of Electrical and Computer Engineering (ECE).

Guo’s research interests include machine learning and optimization, and their applications in microwave design and electronic packaging problems. His award-winning paper, “2D Spectral Transposed Convolutional Neural Network for S-Parameter Predictions,” proposes to use 2D transposed convolutional kernel to solve the dimensionality problem when utilizing machine learning method for s-parameter predictions in packaging problems.

EPEPS is the premier international conference on advanced and emerging issues in electrical modeling, analysis and design of electronic interconnections, packages, and systems. It also focuses on new methodologies and design techniques for evaluating and ensuring signal, power, and thermal integrity in high-speed designs. EPEPS is jointly sponsored by the IEEE Electronics Packaging Society, IEEE Microwave Theory and Techniques Society, and IEEE Antenna and Propagation Society. This year’s conference was held on Oct. 9-12 in San Jose, Cali.

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School of Electrical and Computer Engineering

Categories
Institute and Campus, Student Research, Engineering, Nanotechnology and Nanoscience
Related Core Research Areas
Electronics and Nanotechnology
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Keywords
Yiliang Guo, Electrical Performance of Electronic Packaging and Systems (EPEPS 2022) Conference, 3D Systems Packaging Research Center, Georgia Tech School of Electrical and Computer Engineering, Madhavan Swaminathan, 2D Spectral Transposed Convolutional Neural Network for S-Parameter Predictions
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  • Created By: dwatson71
  • Workflow Status: Published
  • Created On: Nov 18, 2022 - 8:46am
  • Last Updated: Nov 18, 2022 - 8:58am