The evolution of wireless communications toward 5G and beyond involves stringent requirements on integration density, system performance, and scalability across frequencies from sub-6 GHz to the G-band. The objective of the proposed research is to comprehensive study the heterogeneous integration (HI) for wireless systems, with an emphasis on 2.5D and emerging 3D chip-embedded architectures on glass substrates. The research covers topics of passive component designs, active chip packaging and system integration, and emphasizes the developments of multi-chip co-embedding, advanced passive components design techniques, antenna-in-package (AiP)/front-end co-design, 3D architecture defining and circuit/package co-realizations. Applications of sub-6GHz PA package, Ku-band receiver, 32 GHz AiP, D-band high-performance filters, and G-band front-end system/subsystems are realized featuring the developed technologies. By combining novel process technologies, advanced electromagnetic/circuit design techniques, and system-level integration methodologies, this work addresses key challenges—loss reduction, performance enhancement, and yield improvement—and positions 2.5D/3D chip-embedded glass architectures as compelling platforms for next-generation wireless HI.