{"686084":{"#nid":"686084","#data":{"type":"event","title":"Ph.D. Dissertation Defense - Xingchen Li","body":[{"value":"\u003Cp\u003E\u003Cstrong\u003ETitle\u003C\/strong\u003E\u003Cem\u003E:\u0026nbsp; Design and Realization of Heterogeneous Integration for 5G and Beyond Wireless Applications\u003C\/em\u003E\u003C\/p\u003E\u003Cp\u003E\u003Cstrong\u003ECommittee:\u003C\/strong\u003E\u003C\/p\u003E\u003Cp\u003EDr.\u0026nbsp;Madhavan Swaminathan, ECE, Chair, Advisor\u003C\/p\u003E\u003Cp\u003EDr.\u0026nbsp;Nima Ghalichechian, ECE, Co-Advisor\u003C\/p\u003E\u003Cp\u003EDr.\u0026nbsp;Andrew Peterson, ECE\u003C\/p\u003E\u003Cp\u003EDr.\u0026nbsp;Gregory Durgin, ECE\u003C\/p\u003E\u003Cp\u003EDr.\u0026nbsp;Jane Gu, ECE\u003C\/p\u003E\u003Cp\u003EDr.\u0026nbsp;Suresh Sitaraman, ME\u003C\/p\u003E","summary":"","format":"limited_html"}],"field_subtitle":"","field_summary":[{"value":"\u003Cp\u003EThe evolution of wireless communications toward 5G and beyond involves stringent requirements on integration density, system performance, and scalability across frequencies from sub-6 GHz to the G-band. The objective of the proposed research is to comprehensive study the heterogeneous integration (HI) for wireless systems, with an emphasis on 2.5D and emerging 3D chip-embedded architectures on glass substrates. The research covers topics of passive component designs, active chip packaging and system integration, and emphasizes the developments of multi-chip co-embedding, advanced passive components design techniques, antenna-in-package (AiP)\/front-end co-design, 3D architecture defining and circuit\/package co-realizations. Applications of sub-6GHz PA package, Ku-band receiver, 32 GHz AiP, D-band high-performance filters, and G-band front-end system\/subsystems are realized featuring the developed technologies. By combining novel process technologies, advanced electromagnetic\/circuit design techniques, and system-level integration methodologies, this work addresses key challenges\u2014loss reduction, performance enhancement, and yield improvement\u2014and positions 2.5D\/3D chip-embedded glass architectures as compelling platforms for next-generation wireless HI.\u003C\/p\u003E","format":"limited_html"}],"field_summary_sentence":[{"value":"Design and Realization of Heterogeneous Integration for 5G and Beyond Wireless Applications "}],"uid":"28475","created_gmt":"2025-10-29 19:24:04","changed_gmt":"2025-10-29 19:25:30","author":"Daniela Staiculescu","boilerplate_text":"","field_publication":"","field_article_url":"","field_event_time":{"event_time_start":"2025-11-10T13:00:00-05:00","event_time_end":"2025-11-10T15:00:00-05:00","event_time_end_last":"2025-11-10T15:00:00-05:00","gmt_time_start":"2025-11-10 18:00:00","gmt_time_end":"2025-11-10 20:00:00","gmt_time_end_last":"2025-11-10 20:00:00","rrule":null,"timezone":"America\/New_York"},"location":"Room W218, Van Leer","extras":[],"related_links":[{"url":"https:\/\/teams.microsoft.com\/l\/meetup-join\/19%3ameeting_NWJiYWJlZWItMTE0ZS00ZmY3LWI0M2ItM2Q3ZDdjNTE1MmY0%40thread.v2\/0?context=%7b%22Tid%22%3a%22482198bb-ae7b-4b25-8b7a-6d7f32faa083%22%2c%22Oid%22%3a%229053d4cf-43b7-4147-9965-ad166008ee69%22%7d","title":"Microsoft Teams Meeting link"}],"groups":[{"id":"434381","name":"ECE Ph.D. Dissertation Defenses"}],"categories":[],"keywords":[{"id":"100811","name":"Phd Defense"},{"id":"1808","name":"graduate students"}],"core_research_areas":[],"news_room_topics":[],"event_categories":[{"id":"1788","name":"Other\/Miscellaneous"}],"invited_audience":[{"id":"78771","name":"Public"}],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[],"email":[],"slides":[],"orientation":[],"userdata":""}}}