686084 event 1761765844 1761765930 <![CDATA[Ph.D. Dissertation Defense - Xingchen Li]]> Title:  Design and Realization of Heterogeneous Integration for 5G and Beyond Wireless Applications

Committee:

Dr. Madhavan Swaminathan, ECE, Chair, Advisor

Dr. Nima Ghalichechian, ECE, Co-Advisor

Dr. Andrew Peterson, ECE

Dr. Gregory Durgin, ECE

Dr. Jane Gu, ECE

Dr. Suresh Sitaraman, ME

]]> The evolution of wireless communications toward 5G and beyond involves stringent requirements on integration density, system performance, and scalability across frequencies from sub-6 GHz to the G-band. The objective of the proposed research is to comprehensive study the heterogeneous integration (HI) for wireless systems, with an emphasis on 2.5D and emerging 3D chip-embedded architectures on glass substrates. The research covers topics of passive component designs, active chip packaging and system integration, and emphasizes the developments of multi-chip co-embedding, advanced passive components design techniques, antenna-in-package (AiP)/front-end co-design, 3D architecture defining and circuit/package co-realizations. Applications of sub-6GHz PA package, Ku-band receiver, 32 GHz AiP, D-band high-performance filters, and G-band front-end system/subsystems are realized featuring the developed technologies. By combining novel process technologies, advanced electromagnetic/circuit design techniques, and system-level integration methodologies, this work addresses key challenges—loss reduction, performance enhancement, and yield improvement—and positions 2.5D/3D chip-embedded glass architectures as compelling platforms for next-generation wireless HI.

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