Georgia Tech's Packaging Research Centerwill have 23 technical speakers featured at the largest Electronic Components Technology Conference, IEEE ECTC 2015 to be held in San Diego, CA May 26 - 29.  Additionally, Prof. Rao Tummala, Director of PRC, will teach a Professional Development Course entitled "Next Frontier in Electronics: Systems Scaling for Small and Ultra-Small Smart Mobile, Wearable, Medical and IOT Systems."

The PRC in Booth #411, will be displaying information about its research programs encompassing 5 core technologies:  Design Research, Electronic Substrate Research, Photonic Substrate Research, Functional Components Research, and Interconnects & Assembly Research.

The ECTC Program Committee has selected over 350 papers which will be presented in 36 oral sessions and five interactive presentation sessions including one student interactive presentation session. The oral sessions will feature selected papers on 3D and TSV technologies, wafer level packaging, electrical and mechanical modeling, RF packaging, system design, and optical interconnects. Session topics will cover advanced packaging technologies, material development and characterization, reliability, assembly and manufacturing, and power & signal integrity. Four interactive presentation sessions showcase papers in a format that encourages more in-depth discussion and interaction with authors about their work. Similarly, the student interactive presentation session will focus on the research being done at academic institutions around the world by emerging scientists and engineers. The Program Committee has created sessions which cover the ongoing technological challenges of established disciplines as well as addressing emerging topics of interest to the industry. Authors from companies, research institutions, and universities from over 25 countries will present their work at ECTC, illustrating the conference’s global focus.

More information about ECTC can be found at www.ectc.net or the PRC at 404 894-9097 (prcinfo@ece.gatech.edu).