| Short Course on Bioelectromagnetics: Principles and Applications |
Event |
Laurie Haigh |
|
| What is New in Packaging @ Georgia Tech? New Innovations in Thermal Management of 2.5D and 3D Packages |
News |
cheath6 |
|
| What’s New in Packaging @ Georgia Tech? Wafer Fan-Out is a Great Success. What Next? |
News |
cheath6 |
|
| What is New in Packaging @ Georgia Tech? Undergrad Textbook on Device and Systems Packaging |
News |
cheath6 |
|
| What is new in Packaging @ Georgia Tech? 5G Systems in 3D |
News |
cheath6 |
|
| What's New @ GT in Packaging? Innovative EMI Isolation Structures |
News |
Karen May |
|
| What is New @ GT in Packaging? Ultra-thin Dry Film Polymer Materials and Processes for High Density 2.5D and Fanout Packages |
News |
Karen May |
|
| What is New @ GT in Packaging? Advanced Molding Compounds for Fan-out and High-temperature Automotive Electronics |
News |
Karen May |
|
| What is New @ GT in Packaging? 5G and mm-wave Packaging |
News |
Karen May |
|
| What is New @ GT in Packaging? Glass Panel Fan-out |
News |
Karen May |
|
| What is New @ GT in Packaging? 3D Glass Photonics |
News |
Karen May |
|
| What's New at Georgia Tech Packaging: Ultra-thin High-Q RF Inductors |
News |
Karen May |
|
| Low Cost and Ultra-Miniaturized RF Passives and LTE Modules for Consumer and Automotive Needs |
News |
Karen May |
|
| Low Cost and High Performance 2.5D Glass Interposer BGA for Ultra-high Bandwidth at low power |
News |
Karen May |
|
| Automotive Electronics Industry Consortium Workshop @ GT |
Event |
Karen May |
|
