The objective of this research is to develop a co-design framework for glass-based advanced packaging that integrates embedded microfluidic cooling to address thermal challenges in heterogeneous integration. As power densities continue to rise, conventional thermal management techniques fall short in ensuring system reliability and performance. This approach leverages the unique advantages of glass—such as high dimensional stability and excellent electrical insulation—combined with selective laser etching (SLE) to fabricate microchannels directly within the substrate. These channels are strategically optimized for coolant flow and thermal proximity to high-power hotspots. Multiphysics simulations, encompassing thermal, fluidic, and mechanical domains, will inform the design and integration strategy, which will be validated through experimental demonstrations on etched and metallized glass samples. The ultimate goal is to provide a scalable thermal solution for 2.5D and 3D heterogeneous systems, enabling more efficient and reliable operation of high-performance electronic devices.