682725 event 1749249216 1750845733 <![CDATA[Ph.D. Proposal Oral Exam - Joon Woo Kim]]> Title:  System, Packaging, and Device Level Thermal Management approach in Advanced Packaging through Glass-Embedded Microfluidic Channels for Heterogeneous Integration

Committee:

Dr. Swaminathan, Advisor

Dr. Tentzeris, Chair

Dr. Kumar

]]> The objective of this research is to develop a co-design framework for glass-based advanced packaging that integrates embedded microfluidic cooling to address thermal challenges in heterogeneous integration. As power densities continue to rise, conventional thermal management techniques fall short in ensuring system reliability and performance. This approach leverages the unique advantages of glass—such as high dimensional stability and excellent electrical insulation—combined with selective laser etching (SLE) to fabricate microchannels directly within the substrate. These channels are strategically optimized for coolant flow and thermal proximity to high-power hotspots. Multiphysics simulations, encompassing thermal, fluidic, and mechanical domains, will inform the design and integration strategy, which will be validated through experimental demonstrations on etched and metallized glass samples. The ultimate goal is to provide a scalable thermal solution for 2.5D and 3D heterogeneous systems, enabling more efficient and reliable operation of high-performance electronic devices.

]]> <![CDATA[]]> https://teams.microsoft.com/l/meetup-join/19%3ameeting_NzNhZjUwZmUtNjM3OC00ZGJkLTlmMmMtZTNiYzJkZTVmNmVh%40thread.v2/0?context=%7b%22Tid%22%3a%22482198bb-ae7b-4b25-8b7a-6d7f32faa083%22%2c%22Oid%22%3a%22b2a2961a-fc0b-4ed8-a4d1-cb6e5de73e82%22%7d 434371 1788 102851 1808