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ECE Student Seminar | HI Design and Simulation Processes Utilizing Siemens Digital Twin Technology

Title: HI Design and Simulation Processes Utilizing Siemens Digital Twin Technology
Speaker: Ed Clark, Account Executive, Sales at Siemens Digital Industries Software 
Date: Monday, November 4, 2024
Time: 12:30 p.m.-1:20 p.m.
Location: Van Leer Building, C240

Abstract: Overview of the tools and processes for Heterogeneous Integration (HI) design and simulation using Siemens digital twin tools and processes with added information on IC packaging.

Bio: Over three decades in the Electronics industry, designing a wide range of products, SME in IC packaging and HI, design processes and tools, Father of 5, avid hiker, runner and cyclist.

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Summary

Join Siemens Digital Industries Software Account Executive Ed Clark for a talk about HI design and simulation processes utilizing Siemens Digital Twin technology.

Details

Monday
Nov 4 2024
12:30pm - 01:20pm

Location: Van Leer Building, C240

In campus calendar: No

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  • Workflow status: Published
  • Created by: zwiniecki3
  • Created: 10/30/2024
  • Modified By: dwatson71
  • Modified: 11/02/2024

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