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<![CDATA[ECE Student Seminar | HI Design and Simulation Processes Utilizing Siemens Digital Twin Technology]]>
Title: HI Design and Simulation Processes Utilizing Siemens Digital Twin Technology
Speaker: Ed Clark, Account Executive, Sales at Siemens Digital Industries Software
Date: Monday, November 4, 2024
Time: 12:30 p.m.-1:20 p.m.
Location: Van Leer Building, C240Abstract: Overview of the tools and processes for Heterogeneous Integration (HI) design and simulation using Siemens digital twin tools and processes with added information on IC packaging.
Bio: Over three decades in the Electronics industry, designing a wide range of products, SME in IC packaging and HI, design processes and tools, Father of 5, avid hiker, runner and cyclist.
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Join Siemens Digital Industries Software Account Executive Ed Clark for a talk about HI design and simulation processes utilizing Siemens Digital Twin technology.]]>
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