Muhannad Bakir has been named interim director of the Institute for Electronics and Nanotechnology’s Packaging Research Center (PRC). Bakir will assume this role on December 1, 2022.

"I am delighted that Professor Bakir has agreed to serve the campus community in this capacity,” said Michael Filler, IEN’s associate director for research programs. “His deep expertise in electronics packaging, proven leadership, and steady judgement will be an asset to PRC during this transition.”

The PRC is a graduated National Science Foundation Engineering Research Center focusing on advanced packaging and system integration leading to System on Package technologies. The Center conducts research and education in all aspects of electronics packaging that includes design, materials, process, assembly, thermal management, and integration driven by applications, which includes broad areas such as high-performance computing, artificial intelligence, automotive, broadband wireless, and space.

The PRC team consists of 29 faculty from five schools at Georgia Tech, 11 researchers and administrative staff, more than 50 graduate and undergraduate students, and several visiting engineers. This is enabled through collaboration with 48 industry and government organizations and 14 universities in North America, Europe, and Asia.

“I look forward to collaborating with the campus community in this new capacity to continue Georgia Tech’s leadership and forward-looking research initiatives in the areas of advanced packaging, heterogeneous integration, and 3D architectures with our partners in the industry and government,” said Bakir.

Bakir, who also serves as the Dan Fielder Professor in the School of Electrical and Computer Engineering and leads the Integrated 3D Systems Group, brings a wealth of experience to his new role as PRC interim director. He and his research group have received more than thirty paper and presentation awards including six from the IEEE Electronic Components and Technology Conference, four from the IEEE International Interconnect Technology Conference, and one from the IEEE Custom Integrated Circuits Conference (CICC). His group was also awarded the 2014 and 2017 Best Papers of the IEEE Transactions on Components Packaging and Manufacturing Technology.

Bakir is the recipient of the 2013 Intel Early Career Faculty Honor Award, 2012 DARPA Young Faculty Award, 2011 IEEE CPMT Society Outstanding Young Engineer Award, and was an Invited Participant in the 2012 National Academy of Engineering Frontiers of Engineering Symposium. He is the co-recipient of the 2018 IEEE Electronics Packaging Society Exceptional Technical Achievement Award “for contributions to 2.5D and 3D IC heterogeneous integration, with a focus on interconnect technologies.” He is also the co-recipient of the 2018 McKnight Foundation Technological Innovations in Neuroscience Awards. In 2020, Bakir was the recipient of the Georgia Tech Outstanding Doctoral Thesis Advisor Award.  
 
Bakir serves as a senior area editor for the IEEE Transactions on Components, Packaging and Manufacturing Technology and was previously an Editor for IEEE Transactions on Electron Devices. He has also served as a Distinguished Lecturer for IEEE EPS.

Learn more about PRC