Flexible Hybrid Electronics Poised to Address Grand Challenges

Suresh K. Sitaraman, Ph.D.
Morris M. Bryan, Jr. Professor; George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology

Abstract: Microsystems have evolved dramatically over the past few decades. Traditional microsystems are rigid and are not amenable to easily bend, stretch, twist, or fold to adapt to complex surfaces associated with human body, aerospace and automotive structures, food and pharmaceutical items, energy harvesting and storage elements, entertainment and communication devices, and other internet-of-things. When configured effectively, flexible hybrid electronic systems have the potential to address some of the grand challenges associated with food supply, clean water, human health, safety and security, energy, and infrastructure. In this presentation, I will discuss the evolution of flexible electronic systems with a particular focus on how they can be tailored to address some of the grand challenges. Specific flexible hybrid electronics examples will be discussed with insight into their operation and usability over a wide spectrum of applications.

Biosketch: Dr. Suresh K. Sitaraman is Morris M. Bryan, Jr. Professor in the George W. Woodruff School of Mechanical Engineering at Georgia Tech. Dr. Sitaraman is the Lead Faculty for Flexible Hybrid Electronics at Georgia Tech, and he also directs the Computer-Aided Simulation of Packaging Reliability (CASPaR) Lab. Dr. Sitaraman’s expertise is in the areas of micro- and nano-scale structure fabrication, testing and characterization, physics-based modeling and reliable design, as applied to rigid and flexible microsystems. Prior to joining Georgia Tech in 1995, Dr. Sitaraman was with IBM Corp. Dr. Sitaraman has co-authored more than 280 journal and conference publications over the past few years. He has managed several research programs funded by US federal agencies, industry, and other sources totaling millions of dollars, and have guided more than 50 PhD and MS students. Dr. Sitaraman’s work has been recognized through several awards and honors. Among them, he has received the Outstanding Achievement in Research Program Development Award (Team Leader) from Georgia Tech in 2017, the ASME/EPPD (Electronic and Photonic Packaging Division) Applied Mechanics Award in 2012 and the Thomas French Achievement Award from the Department of Mechanical and Aerospace Engineering, The Ohio State University in 2012.  Dr. Sitaraman has received the Sustained Research Award from Georgia Institute of Technology – Sigma Xi in 2008 and the Outstanding Faculty Leadership Award for the Development of Graduate Research Assistants, Georgia Institute of Technology in 2006.  His co-authored papers have won the Commendable Paper Award from IEEE Transactions on Advanced Packaging in 2004 and the Best Paper Award from IEEE Transactions on Components and Packaging Technologies in 2001 and 2000. Dr. Sitaraman has also received the Metro-Atlanta Engineer of the Year in Education Award in 1999 and the NSF-CAREER Award in 1997.  Dr. Sitaraman serves as an Associate Editor for IEEE Transactions on Components, Packaging, and Manufacturing Technology.  Dr. Sitaraman is an ASME Fellow.