Your feed items

• Nanostructured Gate Dielectric Boosts Stability of Organic Thin-Film Transistors

  Dateline: 01/12/2018
• Su Invited to Rising Stars Workshop

  Dateline: 06/29/2018
• Ferroelectricity’s Mystery Sister may do Twice the Work for Less

  Dateline: 06/11/2018
• Spring 2018 IEN Seed Grant Winners Announced

  Dateline: 06/04/2018
• What is New in Packaging @ Georgia Tech? New Innovations in Thermal Management of 2.5D and 3D Packages

  Dateline: 05/18/2018
• Helping the Air Force Search for Actionable Intelligence Worldwide

  Dateline: 05/08/2018
• Severe Storms Research Center Works to Improve Tornado Warning Time

  Dateline: 04/19/2018
• What’s New in Packaging @ Georgia Tech? Wafer Fan-Out is a Great Success. What Next?

  Dateline: 04/13/2018
• What is New in Packaging @ Georgia Tech? Undergrad Textbook on Device and Systems Packaging

  Dateline: 04/06/2018
• What is new in Packaging @ Georgia Tech? 5G Systems in 3D

  Dateline: 03/30/2018
• Piezoelectric Tiles Light the Way for Kennedy Space Center Visitors

  Dateline: 12/13/2017
• Georgia Tech and NextFlex Team-Up to Make the Internet-of-Things More Flexible & Power Efficient

  Dateline: 12/07/2017
• Fall 2017 Georgia Tech Institute for Electronics and Nanotechnology (IEN) Seed Grant Program Winners Announced

  Dateline: 11/14/2017
• 2017 STAMI Fellowship Symposium a Success

  Dateline: 07/05/2017
• What's New @ GT in Packaging? Innovative EMI Isolation Structures

  Dateline: 12/15/2016
• What is New @ GT in Packaging? Advanced Molding Compounds for Fan-out and High-temperature Automotive Electronics

  Dateline: 11/17/2016
• What is New @ GT in Packaging? Ultra-thin Dry Film Polymer Materials and Processes for High Density 2.5D and Fanout Packages

  Dateline: 12/01/2016
• What is New @ GT in Packaging? 5G and mm-wave Packaging

  Dateline: 10/17/2016
• What is New @ GT in Packaging? 3D Glass Photonics

  Dateline: 09/29/2016
• What is New @ GT in Packaging? Glass Panel Fan-out

  Dateline: 10/06/2016