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Large Silicon, Glass or Low-CTE Organic Package to Printed Wiring Board SMT Interconnections

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Monday Jul 15 2013

Publication: main streets

Article URL: http://www.chipscalereview.com/tech_monthly/csrtm-0713-smt-interconnections.php

Groups

Institute for Electronics and Nanotechnology

Status

  • Workflow Status: Published
  • Created By: Christa Ernst
  • Created: 10/15/2013
  • Modified By: Christa Ernst
  • Modified: 10/07/2016

Categories

Institute and Campus , Art Research , Student and Faculty , Engineering , Nanotechnology and Nanoscience

Keywords

2.5D Packages , Organic package , PWB , TCE