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<![CDATA[Large Silicon, Glass or Low-CTE Organic Package to Printed Wiring Board SMT Interconnections]]>
Large, low-TCE packages are required in both high-performance, as 2.5D packages in sizes as large as 60 mm and with lithographic ground rules below 5 microns, as well as in consumer electronics. These low-TCE packages are also needed to avoid stress on the ultra-low k dielectrics within the chip, as they tend to be fragile. Low-TCE packages are required in modern consumer applications to minimize thickness.Read the entire research report at Chip Scale Review online.
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2013-07-15
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