Georgia Tech and its Industry Partners Develop Via-in-Trench with Upto 10X Improvement in I/O Density: A Revolutionary Panel-based RDL Process Technology Capable of 200-450 I/O/mm/Layer Figure 1 | Mercury

image

Georgia Tech and its Industry Partners Develop Via-in-Trench with Upto 10X Improvement in I/O Density: A Revolutionary Panel-based RDL Process Technology Capable of 200-450 I/O/mm/Layer Figure 1

Details

Resolution: 617 x 1103

Created By: cheath6 - 04/10/2018 10:51 AM

Modified: 04/10/2018 10:51 AM

File Size: 136.78kB