<![CDATA[Georgia Tech and its Industry Partners Develop Via-in-Trench with Upto 10X Improvement in I/O Density: A Revolutionary Panel-based RDL Process Technology Capable of 200-450 I/O/mm/Layer Figure 1]]>

604901 image 1523371869 1523371869 <![CDATA[Georgia Tech and its Industry Partners Develop Via-in-Trench with Upto 10X Improvement in I/O Density: A Revolutionary Panel-based RDL Process Technology Capable of 200-450 I/O/mm/Layer Figure 1]]> 213791