Microsystems Packaging
| Story Title | Content type | Authored by | Authored on |
|---|---|---|---|
| Woodruff School of Mechanical Engineering Seminar: Micro/nano Joining Technologies for Next-gen Heterogeneous Integration - Dr. Vanessa Smet; Packaging Research Center at Georgia Tech | Event | Christa Ernst | |
| 2nd Annual IEN User Science and Engineering Review (IEN USER) Day &10th Anniversary of 100 kV EBL | Event | Christa Ernst |