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3D chip design

Story Title Content type Authored by Authored on
Georgia Institute of Technology Research in Microelectronics Dominates the 2021 International Electron Device Meeting News Christa Ernst 2021-12-03
SENIC Ambassadors Webinar Series: Heat Transfer Across Length Scales – Focus on Thermal Management and Advanced Sensing Event Christa Ernst 2020-06-24
Handbook of 3D Integration Published News Jackie Nemeth 2019-04-24
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