2.5D/3D Heterogeneous Integration: Emerging Trends and Opportunities - This presentation begins by motivating the need for advanced 2.5D and 3D heterogeneous integration (3DHI) technologies. An overview of emerging 3DHI approaches for both digital and RF/mm-wave applications will then be presented, leveraging silicon- and glass-based platforms. Particular focus will be placed on novel integration approaches, including inverse hybrid bonding, silicon and glass chiplet reconstitution, and 3D stitch-chip architectures. Opportunities for photonic co-integration will also be highlighted. The presentation concludes with an overview of Georgia Tech’s recently established and unique microfabrication and advanced assembly/bonding capabilities for 3DHI.