The objective of the proposed research is to design a high trapping bandwidth electrostatic levitation system termed ‘electrostatic clamping’, specifically designed for Coriolis vibratory gyroscopes (CVGs) and wafer-level-packaged MEMS die. Recent breakthroughs in new MEMS design and material have pushed the MEMS CVGs to near navigation grade performance, with the anchor loss being a bottleneck. By levitating the resonating structure, we eliminate the anchor loss of the MEMS sensor, potentially pushing the quality factor (Q) to the limit of Akhiezer loss. We can also improve the bias stability of a MEMS IMU by levitation such that the sensor is decoupled from the environment. However, both applications require a rigid trapping to accurately transfer the inertia from the chassis to the sensor.