The objective of the proposed research is to study further and characterize CMIs for heterogeneous integration applications. The need for chiplets presents unique challenges at the package level, which include overall yield and rework, as a faulty chiplet or assembly can render an entire package unusable. This increases testing costs, as individual dice must be evaluated before assembly. For this reason, test sockets and probe cards have become more important than ever. The temporary connection in test sockets is typically made through compliant interconnects, such as pin springs, elastomer contacts, or probes with various form factors. The pitch for these types of interconnects is usually in the range of hundreds of micrometers. As off-chip interconnect pitch continues decreasing and the need for IC test continues to increase, a new compliant interconnect solution needs to be developed to address the issues. Therefore, CMIs are proposed to address these problems. CMIs of 150 μm pitch are designed and fabricated in an array. They are assembled using the PINCH assembly, a 3D printed socket, with the four-wire DC resistance resulting in an average of 127.7 mΩ. Additionally, a new epoxy bonding method is developed using corner fill to measure the CMI resistance ex-situ, with an average DC resistance of 335.24 mΩ. To further explore the capabilities of CMIs and expand their range of applications, preliminary resistance measurements were taken in cryogenic conditions. The data shows that CMIs can maintain contact down to sub-kelvin temperatures. Future work includes characterizing the CMI's elastic deformation, developing and testing CMIs for quantum computing applications—which involves exploring superconducting materials—and scaling down standard CMI and superconducting CMI pitches.