Abstract: Photonic integrated circuits (PICs) have significantly advanced the development of compact optical devices, enhancing their commercial availability and utility. These circuits are created from diverse materials including III–V semiconductors, silicon, silicon nitride, lithium niobate, and polymers, each contributing unique properties. However, the true potential of PICs is unleashed through hybrid/heterogenous integration, a process that combines different material platforms via optical coupling to achieve multifunctional capabilities beyond the reach of single-material systems. In this talk, I will discuss innovative methodologies and applications of hybrid integration for chip-scale laser systems. Furthermore, I will discuss automated assembly and packaging processes designed to seamlessly couple passive PICs with active semiconductor chips, addressing a critical gap in the scalability and manufacturability of hybrid integrated systems. This approach not only propels the performance of chip-scale lasers but also paves the way for new opportunities in communication, computing, sensing, and beyond.

Bio: Dr. Lin Zhu is currently Dean’s Distinguished Professor at the Electrical and Computer Engineering Department of Clemson University. He completed his Ph.D. in Electrical Engineering at California Institute of Technology in 2008. Lin’s research includes hybrid photonic integration, high power diode lasers, beam combining, and integrated quantum photonics which have been funded by many federal agencies, including ARO, DARPA, NASA, NAVSEA, NSF, ORAU, and US Army SMDC. He is the recipient of the DARPA Young Faculty Award, ARO Young Investigator Award, and ORAU Ralph E. Powe Junior Faculty Enhancement Award. He also serves on the technical committees of many IEEE/OSA conferences.