The objective of this research is to develop advanced glass packaging technology to enhance the performance of RF front-end (RFFE) modules in the D-band (110 GHz to 170 GHz) for next-generation wireless communication (6G). The focus is on heterogeneous integration solutions for 140 GHz CMOS IC and Indium Phosphide (InP) power amplifier (PA) RFFE modules, demonstrating the superior performance of the first D-band PA-antenna module using advanced die-embedded glass substrate. This work addresses the challenges of antenna integration, interconnect loss, and thermal management. The innovative packaging solution leverages the advantages of glass substrates, including excellent thermal-mechanical reliability, fine feature size, and low cost for scalability to large arrays. By embedding the Si passive dies and InP PAs at the center of the glass substrate, the design facilitates ultra-short die-to-package interconnects through dielectric vias, achieving remarkably low loss at 140 GHz and excellent matching across the 110 GHz to 170 GHz frequency range. The design also accommodates the seamless integration of a microstrip patch antenna array. Moreover, the die-embedded glass package incorporates a copper heat spreader on the PA's backside, significantly enhancing thermal management. Compared to current packaging solutions for state-of-the-art D-band modules, this approach offers superior electrical and thermal performance and assembly simplicity. Additionally, this research explores novel interconnects, such as planar Goubau lines on glass substrates, to address on-package transmission challenges. With its outstanding electrical and thermal performance, scalability, and cost-effectiveness, glass packaging presents a promising solution for developing D-band beamforming arrays in next-generation communication systems.