Silicon has been the widely used material for integrated photonics due to the availability of the advanced foundry infrastructure. Recently, silicon carbide and lithium niobate have been widely investigated for chip-scale photonics, bringing owing to their unique photonic properties spanning across classical and quantum applications. Compared to silicon, these materials offer wide transparency and high-speed electro-optic effect which is necessary to address the energy-speed barrier in computing. In this research, I present a novel hybrid material platform enabled for the first time, through heterogenous integration of SiC and LN. While heterogenous integration through wafer bonding is a well-known process in photonics, especially for laser integration, we need to overcome the thermal expansion challenge of materials. I will discuss - 1) the process flow for developing the hybrid SiC-LN, 2) photonic device fabrication, and the 3) demonstration of electro-optic phase shift. This will be followed by the discussion of CMOS-photonics, and on-package interconnects – which is the state-of-the art technology used in industry with Si, silicon nitride, and glass  materials. Here, I discuss my research accomplishments in the fabrication of microheaters for reconfigurability, and the development of an on-package optical interconnects. The novel material platform demonstrated here will provide a new pathway for unique device architectures spanning across classical and quantum computing applications.