Advances in semiconductor fabrication technology, particularly lithographic processes, have allowed for a reduction in the transistor minimum feature size. This has resulted in faster and densely packed transistors operating at lower voltage levels, which has allowed engineers to design complex mixed-signal/RF circuitry for new wireless system platforms with an unimaginable degree of integration and functionality. As a result, in the past few decades there has been a push from industry and academia to create wireless systems for sensor networks, IoT devices, and consumer electronics that employ mm-Wave frequencies. These wireless systems are targeted towards the health care industry, manufacturing, consumer products, Department of Defense (DoD) related applications, and wireless tags, among others. 5G enabled systems and devices will create a huge impact across multiple industries, such as automotive, health care, consumer products, space, scientific, and military. For 5G systems to be successfully deployed, broadband or reconfigurable hardware that operates throughout the entire 5G spectrum is needed. Some of the main advantages offered by 5G networks are the compact hardware size due to the high level of integration provided by the smaller wavelength at higher frequencies. In the same manner, the 6G and sub-THz spectrum is opening the doors to new opportunities to create miniaturized systems on-chip with some degree of functionality that integrate on-chip network connectivity and chip-to-chip sensing capabilities. One of the biggest challenges for new generation wireless networks and systems operating at mm-Wave and sub-THz frequencies is transmitter power and efficiency. In most transceiver designs, power amplification blocks, which include power amplifiers and oscillators, dominate the overall system efficiency, thermal performance, and data rate. Moreover, it is extremely difficult to transmit a signal efficiently over the air at mm-Wave and sub-THz frequencies due to the higher path losses. In this dissertation, I focus on leveraging modern semiconductor technology nodes to explore new circuit and design techniques that will increase the efficiency, bandwidth, and level of integration that will address the beforementioned challenges of future wireless systems.