The objective of the proposed research is to investigate multi-dimensional data towards developing prediction models within an interposer package. As speeds climb >200Gb/s, heterogeneous integration has become a compelling technology for scaling performance outside of Moore's law. At such high speed for several applications such as AI/ML, 6G, and digital and mm-wave chips, designers have increased challenges in diagnosing parasitic effects and performing co-optimization of the interposer package and chip at the pre-layout stage. This work presents an accurate wideband model characterization for a complete signal path within the interposer package. By conducting loss studies on scalable electrical models, and using the signal path framework for prediction, the proposed research proffers variance-based measurements towards developing prediction models along with uncertainty quantification of the package design performance. In addition, we explore advanced packaging co-design relationships with optimal packaging design flow. A test vehicle with variance-based measurements has been designed and fabricated on an organic interposer as part of the proposed research. VNA measurement have been collected to characterize the return loss, the insertion loss and the crosstalk in the low-loss, flexible material up to 100 GHz. Printed circuit board structures have been explored, designed and simulated to explore tradeoff relationships in the chip-to-chip interconnect loss.