The objective of this thesis is to create a glass interposer technology suitable for the sub-THz frequency range, specifically for D-band frequencies that support 6G wireless networks. As nextgeneration systems require carrier frequencies above 100 GHz to achieve multi-GHz bandwidth and support data rates up to 1 Tbps, glass interposer technology is gaining popularity due to its superior electrical performance, low cost, and ability to support fine feature sizes. This study aims to introduce novel structures that can be implemented on the substrate interposer. The proposed work outlines a novel implementation of a vertical contactless interconnect called vertical via-less interconnects, which are characterized using different dielectrics up to 170 GHz. Additionally, end-fire antenna arrays based on vivaldi radiators are discussed. A process to create through glass vias is developed to implement substrate integrated waveguide (SIW). These antenna arrays are designed to cover the frequency range of 110-170 GHz. The thesis includes the characterization of these arrays, along with a method to measure a normalized radiation pattern.