The objective of this thesis is to present a comprehensive perspective on the challenges associated with node scaling by investigating, modeling, and analyzing possible advanced interconnect technology solutions. This thesis investigates various advanced interconnect technology solutions including 3D integration, geometry optimization of wires with ultra-narrow widths, and the utilization of alternative materials for interconnects as promising solutions to address the node scaling challenges. While device scaling has been a primary method of continuing Moore's law, it has become increasingly difficult to continue improving power and performance as we get close to the end of scaling with physical challenges such as channel length scaling and lithographic challenges. While 3D integration show promising results in improving circuit PPA, it still suffers from various challenges such as thermal management, lack of design tools and methodologies as well as reliability testing. As a more interim and immediate solution, this thesis explores the impact of various interconnect technologies at the 7nm technology node. This involves exploring the effects of various back-end-of-the-line (BEOL) options on signal and power routing, as well as the parasitics within standard cells and memory components. In addition, this thesis also paves the way to investigating interconnect technologies at more advanced nodes such as the 3nm technology node as we develop a predictive 3nm process design kit (PDK).