Title:  Self-Aligned Optical Interconnects for Chiplets Arrays in 2.5D/3D Heterogeneous Integration: Design, Fabrication, Assembly and Test

Committee: 

Dr. Bakir, Advisor

Dr. Gaylord, Co-Advisor

Dr. Ralph, Chair

Dr. Brand

Abstract: The objective of the proposed research is to develop the technology needed to connect optical fibers directly to on-chip photonics and to do so in a scalable, potentially inexpensive manner.  Nano-scale 3D printing and silicon micro-fabrication will be used to achieve unprecedented sub-micron placement of arrays of optical fibers to the chip.  Configurations with 100+ fiber insertion points with insertion losses comparable to that achieved with active alignment will be developed.  Further research on several facets including better alignment accuracy, robustness of the alignment structures, and compatibility with existing technologies are proposed.