Title:  Exploration, Modeling, and Optimization of Advanced Interconnects: Solutions to Node Scaling Challenges

Committee: 

Dr. Naeemi, Advisor

Dr. Lim, Co-Advisor

Dr. Davis, Chair

Dr. Mukhopadhyay

Abstract: The objective of the proposed research is to explore novel interconnect options and to develop an accurate modeling/technology-design co-optimization flow to evaluate BEOL improvements at the advanced nodes. The modeling framework includes the BEOL impact on circuit performance (inter-cell connections) as well as wire parasitics within standard cells and SRAM memory blocks (intra-cell connections) and their impact on full chip circuit performance. The preliminary research includes exploration of 3D IC design space with 3D clocktree methods and re-exploration of low power techniques in the context of 3D ICs as well as the modeling and benchmarking of different interconnects options. The proposed research aims to expand the interconnect modeling framework and provide a way to easily perform a wholistic analysis of different BEOL options on full chip power, performance, and area (PPA).