Title:  Heterogeneous Integration for High-Speed mm-wave Communications

Committee: 

Dr. Swaminathan, Advisor      

Dr. Ghalichechian, Chair

Dr. Peterson

Abstract: The objective of the proposed research is to demonstrate heterogeneous integration for 6G applications that include back-end high-speed processing. AI applications require specialized chips that need to communicate with each other through interconnections. The primary focus of this work is to demonstrate high-speed communication between chips through non-TSV based integration. The proposed research demonstrates highly integrated modules with embedded dies and thin film components such as antennas working at high frequencies. An integrated and miniaturized printed quasi-Yagi antenna and antenna arrays have been designed and fabricated on glass interposer as part of the proposed research. A probe-station-based measurement set-up has been created to characterize the return loss, the antenna gain and the radiation pattern. Via chain structures have been designed and fabricated to characterize the chip-to-package microvia interconnect loss in low-loss polymer buildup film in D-band (110 - 170 GHz) with 2x lower loss compared to flip-chip transitions.