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Fall 3D Systems Packaging Research Center (PRC) Kickoff Meeting
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We would like to invite you to the Fall 3D Systems Packaging Research Center (PRC) kickoff meeting, which will take place virtually this year.
With the federal government making plans for significant investment in semiconductor technology, packaging & heterogeneous integration are becoming important areas to address. This meeting will discuss the current State of PRC as well as emerging opportunities and plans in this area.
An agenda for the meeting may be found at http://www.prc.gatech.edu/prc-fall-kickoff-meeting/.
The meeting is scheduled for Wednesday ,August 25 at 11:00 AM EDT and you can join at the link below.
https://gatech.webex.com/gatech/j.php?MTID=mc9784fa7274da6f3e2285415cd0ccde7
Meeting number: 180 800 5803
Password: b8qDcCzx6j2
Join by phone
+1-415-655-0001 US TOLL
Access code: 180 800 5803
Status
- Workflow status: Published
- Created by: Jackie Nemeth
- Created: 07/21/2021
- Modified By: Jackie Nemeth
- Modified: 07/30/2021
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