Title:  Electronic Design Automation Solutions and Design Tradeoffs for Emerging Heterogeneous 2.5D and 3D ICs

Committee: 

Dr. Lim, Advisor  

Dr. Swaminathan, Chair

Dr. Mukhopadhyay

Abstract: The objectives of this proposed research span from addressing the shortcomings of 2D ICs including the scaling and the design complexity to design and CAD methodologies for emerging 2.5D and 3D integrations and observation on the design tradeoffs between technologies in each category. The proposed research includes 1) a vertically-integrated EDA flow for an interposer-based 2.5D IC design which covers and fully automates the whole design phases of architecture, circuit and package, 2) the tradeoff studies on various 2.5D integration options including power delivery scheme and interposer technologies, 3) the study on PPA and reliability tradeoffs between the state-of-the-art 3D integration technologies, 4) chiplet/interposer co-design flow for 2.5D PDN optimization, and 5) a test-aware monolithic 3D IC design methodology enabling the effective defect screening and quality assurance.