Title:  Thermal-Electrical Co-design and Tradeoff analysis for 2.5-D and 3-D Integration Technologies

Committee: 

Dr. Bakir, Advisor

Dr. Naeemi, Chair

Dr. Raychowdhury

Abstract:

The objective of the proposed research is to investigate and benchmark different 2.5D and 3D heterogeneous integration technologies on the thermal and electrical performance and their interdependencies. The demand for data generated from machine learning, artificial intelligence, etc. is exponentially increasing, driving the need high performance computing systems. Owing to advanced technologies, the total power density is expected to increase beyond 100 W/cm2; power delivery becomes a critical challenge, and advanced cooling solutions are turning into a necessity.  Moreover, reduced noise margin determined by the scaling trend of the technology is making the power delivery to the chip ever more challenging. Placing dice side-by-side poses thermal coupling issues where heat flows from the high power die to the low power die. There is also inter-dependencies among these different domains. Therefore, in this research effort, 1) a thermal-power delivery network (PDN) will be developed to investigate the transient Ldi/dt noise of bridge-based 2.5D technologies, 2) the thermal-PDN co-analysis framework in (1) will be utilized to evaluate different fan-out wafer level packaging (FOWLP) and 3D FOWLP technologies,  and 3) a novel backside-PDN configuration will be benchmarked where the PDN is separated from the signaling network of the die.  The proposed tasks will feed into one another, in order to develop more comprehensive pre-design analysis of heterogeneous integration systems.