Title:  Design Challenges and CAD Solutions for Low Power and Reliable Monolithic 3D ICs

Committee:

Dr. Sung Kyu Lim, ECE, Chair , Advisor

Dr. Arijit Raychowdhury, ECE

Dr. Saibal Mukhopadhyay, ECE

Dr. Azad Naeemi, ECE

Dr. Hyesoon Kim, CS

Abstract:

The objective of this research is to study and quantify the major challenges in low power and reliable monolithic 3D IC design and to develop CAD solutions to address these challenges, in order to obtain maximum benefits from this emerging technology. The key design challenges in monolithic 3D ICs covered in this research include thermal modeling and optimization, 3D PDN design and analysis, and addressing inter-tier performance difference and inter-tier interconnect difference in monolithic 3D ICs. In addition, monolithic 3D IC power-performance cost comparison with other technologies is also studied.