Title:  Thermal and Power Delivery Network Modeling for Emerging Integration Platforms

Committee: 

Dr. Bakir, Advisor        

Dr. Mukhopadhyay, Chair

Dr. Naeemi

Abstract:

The objective of this proposed research is to perform thermal and power delivery network (PDN) analysis and optimization for emerging integration systems such as three-dimensional and 2.5 dimensional integrated circuits. The key contribution of this research is in fourfold. First, a compact thermal model is developed and used for analyzing conventional 2-D, emerging 2.5-D and 3-D architectures. Second, a novel 3-D stacking structure with microfluidic cooling, thermal isolation using air gap and mechanically flexible interconnects, and an extended heat spreader is proposed, evaluated and demonstrated. Third, thermal studies are performed focusing on 2.5-D bridge-chip based platforms and benchmarked with other 2.5-D and 3-D integration solutions. Last, an integrated framework analyzing the power, thermal and power delivery network simultaneously is proposed. The error is quantified between the models that consider different parts of the interactions.