Title:  3D and 2.5D Heterogeneous Integration Platforms with Interconnect Stitching and Microfluidic Cooling

Committee: 

Dr. Bakir, Advisor

Dr. May, Co-Advisor   

Dr. Naeemi, Chair

Dr. Brand

Abstract: The objective of the proposed research is to investigate and address the unknowns and challenges in 3D/2.D IC from both electrical and thermal aspects. Testbeds will be fabricated and characterized to experimentally analyze the performance of 3D IC links, 2.5D interconnect stitching platforms and embedded microfluidic cooling. The key contributions of this work will include: 1) development of a compact physical model of TSV capacitance and a circuit level model of the signal delay for 3D IC links considering frequency dependency; 2) fabrication of a 3D IC link testbed that emulates the interaction of on-chip wires and TSVs to experimentally analyze the impact of TSV on electrical performance of 3D IC; 3) fabrication and characterization of background cooling testbeds with embedded micropin-fin heat sinks; 4) fabrication and characterization of hotspot cooler testbed for convective boiling experiments in extreme-micro-gap; 5) fabrication of a 3D IC link testbed with embedded microchannels and investigate the impact of microfluidic cooling on signaling in 3D IC; 6) fabrication of a heterogeneous interconnect stitching platform with compressible microinterconnects for high bandwidth density, low cost system-in-package.