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• Tentzeris Named Distinguished Lecturer by Electronic Packaging Society

  Dateline: 07/14/2023
• A Signal of Danger in Heart Disease

  Dateline: 07/09/2021
• New Flexible Electronics Research Shows Promise for Spinal Therapies

  Dateline: 08/07/2020
• Spontaneous Formation of Nanoscale Hollow Structures Could Boost Battery Storage

  Dateline: 06/13/2020
• Ravichandran Chosen for IMAPS Best Paper Award

  Dateline: 01/08/2019
• Nanostructured Gate Dielectric Boosts Stability of Organic Thin-Film Transistors

  Dateline: 01/12/2018
• Su Invited to Rising Stars Workshop

  Dateline: 06/29/2018
• Ferroelectricity’s Mystery Sister may do Twice the Work for Less

  Dateline: 06/11/2018
• Spring 2018 IEN Seed Grant Winners Announced

  Dateline: 06/04/2018
• Georgia Tech and NextFlex Team-Up to Make the Internet-of-Things More Flexible & Power Efficient

  Dateline: 12/07/2017
• Fall 2017 Georgia Tech Institute for Electronics and Nanotechnology (IEN) Seed Grant Program Winners Announced

  Dateline: 11/14/2017
• What's New @ GT in Packaging? Innovative EMI Isolation Structures

  Dateline: 12/15/2016
• What is New @ GT in Packaging? Advanced Molding Compounds for Fan-out and High-temperature Automotive Electronics

  Dateline: 11/17/2016
• What is New @ GT in Packaging? Ultra-thin Dry Film Polymer Materials and Processes for High Density 2.5D and Fanout Packages

  Dateline: 12/01/2016
• What is New @ GT in Packaging? 5G and mm-wave Packaging

  Dateline: 10/17/2016
• What is New @ GT in Packaging? 3D Glass Photonics

  Dateline: 09/29/2016
• What is New @ GT in Packaging? Glass Panel Fan-out

  Dateline: 10/06/2016
• Spring 2016 Georgia Tech Institute for Electronics and Nanotechnology (IEN) Seed Grant Program Winners Announced

  Dateline: 05/12/2016
• Low Cost and Ultra-Miniaturized RF Passives and LTE Modules for Consumer and Automotive Needs

  Dateline: 02/04/2016