Engineered “Sand” May Help Cool Electronic Devices |
News |
John Toon |
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Innovation Addresses Rising Thermal Challenges in Mobile Devices, Computers and Data Centers |
News |
John Toon |
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Prof. Stone’s research fuels the cooling of Louisville |
External News |
Jessie Brandon |
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Heat-Conducting Polymer Cools Hot Electronic Devices at 200 Degrees C |
News |
John Toon |
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“Waviness” Explains Why Carbon Nanotube Forests Have Low Stiffness |
News |
John Toon |
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Project Will Improve Heat Dissipation in 3-D Microelectronic Systems |
News |
John Toon |
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Silver-Diamond Composite Offers Cooling Capabilities for Electronics |
News |
John Toon |
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Heat-Transfer Material Could Allow More Powerful Radar Electronics |
News |
John Toon |
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Improved Techniques Will Help Control Heat in Large Data Centers |
News |
John Toon |
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