| Yu Named Dean’s Professor |
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zwiniecki3 |
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| EDA’s CAEML Grows More Humps: Al Expands Role in Design |
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Christa Ernst |
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| Georgia Tech’s Center for Co-design of Chip, Package System (C3PS) partners with Notre Dame in $26 million multi-university research center developing next-generation computing technologies |
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Christa Ernst |
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| Georgia Tech Professor Rao Tummala to Present Keynote at the 2016 International Wafer-Level Packaging Conference |
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Christa Ernst |
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