Automotive Electronics
| Story Title | Content type | Authored by | Authored on |
|---|---|---|---|
| What is New @ GT in Packaging? Advanced Molding Compounds for Fan-out and High-temperature Automotive Electronics | News | Karen May | |
| The GT 3D Systems Packaging Research Center (PRC) Announces the "New Era of Automotive Electronics (NAE)" Industry/Academic Consortium at its Spring Partnership Meeting | News | Christa Ernst |