| What is New @ GT in Packaging? Ultra-thin Dry Film Polymer Materials and Processes for High Density 2.5D and Fanout Packages |
News |
Karen May |
|
| What is New @ GT in Packaging? Advanced Molding Compounds for Fan-out and High-temperature Automotive Electronics |
News |
Karen May |
|
| What is New @ GT in Packaging? 5G and mm-wave Packaging |
News |
Karen May |
|
| What is New @ GT in Packaging? Glass Panel Fan-out |
News |
Karen May |
|
| What is New @ GT in Packaging? 3D Glass Photonics |
News |
Karen May |
|
| What's New at Georgia Tech Packaging: Ultra-thin High-Q RF Inductors |
News |
Karen May |
|
| Georgia Tech Professor Rao Tummala to Present Keynote at the 2016 International Wafer-Level Packaging Conference |
News |
Christa Ernst |
|
| The GT 3D Systems Packaging Research Center (PRC) Announces the "New Era of Automotive Electronics (NAE)" Industry/Academic Consortium at its Spring Partnership Meeting |
News |
Christa Ernst |
|
| Low Cost and Ultra-Miniaturized RF Passives and LTE Modules for Consumer and Automotive Needs |
News |
Karen May |
|
| Low Cost and High Performance 2.5D Glass Interposer BGA for Ultra-high Bandwidth at low power |
News |
Karen May |
|
| PRC to Exhibit and Have 23 Featured Speakers at ECTC 2015 in San Diego, May 26 - 29 |
News |
Karen May |
|
| IEEE ECTC Features 23 Speakers from Packaging Research Center (PRC) |
News |
Karen May |
|
| Fall 2014 Georgia Tech Institute for Electronics and Nanotechnology (IEN) Seed Grant Program Winners Announced |
News |
Christa Ernst |
|
| 4th Annual Global Interposer Technology (GIT) Workshop |
Event |
Christa Ernst |
|
| Professor Rao Tummala's Viewpoint on Packaging and System Scaling |
External News |
Christa Ernst |
|
