The objective of the proposed research is to develop high-performance packaging solutions for 5G and beyond wireless applications. There are primarily three challenges for module-level RF/mmWave packaging solutions as frequencies increase: low-loss interconnects, thermal management, and process compatibility. At higher frequencies, additional efforts are required for the electrical design to achieve low-loss, impedance matching, and parasitic reduction for chip-to-chip, chip-to-passive, and passive-to-passive interconnects. Thermal management of the package must also be well-considered to support chip functionality, as smaller die sizes increase thermal density. Additionally, proper processes that are compatible with stack-up structures are essential to achieve reliable performance. To address these challenges, glass-based design and realization are introduced in this proposal. For passive component design, novel filter, waveguide, and interconnect structures are proposed and implemented. The D-band filter utilizes a separated coupling path and source-load coupling to implement four transmission zeros, achieving a 6.5% fractional bandwidth and 1.19 dB insertion loss at 140 GHz. A low-profile waveguide technique with metallized trench shielding is proposed for D-band applications. Corresponding designs of waveguides, high-Q resonators, and filters are made. Two different types of multi-layer interconnects, stacked vias and staggered vias, are modeled and demonstrated in 5G bands. For packaging architecture design, a multiple die-embedded and thermal management integrated glass interposer is proposed. The interposer implements the embedding of dies in different glass cavities, and the broadband interconnects covering 40 MHz to 110 GHz are applied with less than 0.5 dB/mm loss. The process of heat spreader attachment is proposed to support a possible thermal management solution for high-power chips. The ongoing work aims to achieve glass packaging for active components, such as power amplifiers and low-noise amplifiers, and explore packaging solutions with potential substrate materials like aluminum ribbon ceramic.