Date: Thursday, July 21, 2022

Time: 8:30 a.m.

Virtual: Seminar Link: https://gatech.zoom.us/j/95488112713

Speaker: 
Kuan-Neng Chen
Institute of Electronics
National Yang Ming Chiao Tung University, Hsinchu, Taiwan

Topic: Low Temperature Cu-Cu and Hybrid Bonding for 3D Integration and Advanced Packaging

Abstract: Bonding technology is the key to the success of vertical stacking in 3D integration, heterogeneous integration, and advanced packaging applications. Furthermore, developing a bonding technology which can be performed at low temperature becomes signigicant to avoid the concerns of low thermal budget, low mechanical stress, and high reliability in many applications. In addition, for material to be used as the bonding medium, Cu has always been the best candidate with its excellent electrical performances, thermal properties, and readiness in the backend and packaging fabrication, as well as cost consideration. This talk will describe the progress and advance of current Cu-based direct bonding, based on parameter optimization, structure design, and material selection. Technology development of low temperature Cu-Cu bonding and corresponding solutions will be described. Finally, Cu-Cu hybrid bonding, an enabling technology for fine pitch/size bonding in multiple 3D integration and advanced packaging applications, will be introduced and further discussed.        

Biography: Dr. Kuan-Neng Chen received his Ph.D. degree in Electrical Engineering and Computer Science, and his M.S. degree in Materials Science and Engineering, both from Massachusetts Institute of Technology (MIT). He is currently Associate Dean of International College of Semiconductor Technology, and Chair Professor of Institute of Electronics in National Yang Ming Chiao Tung University. Prior to the faculty position, he was a Research Staff Member at the IBM Thomas J. Watson Research Center.

Dr. Chen is the recipient of IEEE EPS Exceptional Technical Achievement Award, IMAPS William D. Ashmon – John A. Wagnon Technical Achievement Award, National Industrial Innovation Award, MOST Outstanding Research Award (2 times), MOST Futuristic Breakthrough Technology Award, National Industrial Innovation Award, NCTU Distinguished Faculty Awards, NCTU Outstanding Industry-Academia Cooperation Achievement Awards (6 times), CIE Outstanding Professor Award, CIEE Outstanding Professor Award, and IBM Invention Achievement Awards (5 times). He has authored more than 300 publications, including 3 books and 6 book chapters, and holds 84 patents. He was Guest Editor of MRS Bulletin and IEEE Transactions on Components, Packaging, and Manufacturing Technology. He served as General Chair of IEEE IITC and Program Co-Chair of IEEE IPFA, and committee member of IEDM, IEEE 3DIC, IEEE SSDM, IEEE VLSI-TSA, and IMAPS 3D Packaging. Dr. Chen is a Fellow of National Academy of Inventors (NAI), IEEE, IET, and IMAPS, and a member of Phi Tau Phi Scholastic Honor Society. 

In addition to his faculty position, Dr. Chen is currently Program Director of Micro-Electronics Program in Ministry of Science and Technology in Taiwan, Specially Appointed Professor of Tokyo Institute of Technology (Tokyo Tech) and Adjunct R&D Director in Industrial Technology and Research Institute (ITRI). Dr. Chen’s current research interests are three-dimensional integrated circuits (3D IC), advanced packaging, and heterogeneous integration.