SENIC Ambassadors Webinar Series: Heat Transfer Across Length Scales – Focus on Thermal Management and Advanced Sensing

Event Details
Contact

Dr. Paul Joseph -  Principal Research Scientist, [paul.joseph@ien.gatech.edu]

Summaries

Summary Sentence: New materials, advanced sensing, and developing a more robust understanding of thermal energy transport across length scales is presented, with emphasis on research areas which leverage industry-relevant materials science and microfabrication.

Full Summary: No summary paragraph submitted.

Related Files

Heat Transfer Across Length Scales – Focus on Thermal Management and Advanced Sensing

Dr. Arden Moore - Associate Professor of Mechanical Engineering; Louisiana Tech University

Abstract: The rapid development of faster, cheaper, and more powerful computing has led to some of the most important technological and societal advances in modern history. However, the physical means associated with enhancing computing capabilities at the device and die levels have also created a very challenging set of circumstances for keeping electronic devices cool, a critical factor in determining their speed, efficiency, and reliability. With advances in nanoelectronics and the emergence of new application areas such as three-dimensional chip stack architectures and flexible electronics, now more than ever there are both needs and opportunities for novel materials and strategies to help address some of these pressing thermal management challenges. In this talk, our group’s work in the areas of new materials, advanced sensing, and developing a more robust understanding of thermal energy transport across length scales is presented, with emphasis on research areas which leverage industry-relevant materials science and microfabrication principles.

Bio: Dr. Arden Moore is an Associate Professor of Mechanical Engineering at Louisiana Tech University and holds the Contractor's Trust #1 Endowed Chair. Dr. Moore also has a joint appointment with the Institute for Micromanufacturing (IfM) where he works on advanced materials and devices for multi-scale energy applications. Prior to joining the faculty at Louisiana Tech, Dr. Moore was a Thermal Advisory Engineer for IBM’s Systems & Technology Group from 2011 to 2013 where he designed and developed electronics thermal management solutions from the die level up to full server systems. In addition to academic publications, Dr. Moore is inventor or co-inventor on over a dozen patents or patent applications related to thermal management. He is a 2019 National Science Foundation CAREER Awardee and currently serves on the advisory board of Journal of Physics D: Applied Physics. Dr. Moore graduated with his Ph. D. degree in mechanical engineering from the University of Texas at Austin in 2010.

 

Register Here: https://tinyurl.com/saws2020

Additional Information

In Campus Calendar
Yes
Groups

3D Systems Packaging Research Center, Georgia Electronic Design Center (GEDC), Institute for Electronics and Nanotechnology, NanoTECH, The Center for MEMS and Microsystems Technologies

Invited Audience
Faculty/Staff, Postdoc, Public, Graduate students, Undergraduate students
Categories
Career/Professional development, Seminar/Lecture/Colloquium
Keywords
Institute for Electronics and Nanotechnology, Mechanical Engineering, Materials Engineering, heat transfer, thermal management, microfabrication, mems, 3-D ICs, 3D chip design
Status
  • Created By: Christa Ernst
  • Workflow Status: Published
  • Created On: Jun 24, 2020 - 8:49am
  • Last Updated: Jun 24, 2020 - 8:49am