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Ph.D. Proposal Oral Exam - Tailong Shi
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Title: Design and Demonstration of Ultra-thin, High-performance Glass Panel Embedded (GPE) Packages for RADAR Applications
Committee:
Dr. Tummala, Advisor
Dr. Swaminathan, Chair
Dr. Peterson
Dr. Vogel
Dr. Kathaperumal
Abstract: The objective of the proposed research is to design and demonstrate ultra-thin, high-performance glass panel embedded package (GPE) for RADAR applications. Ultra-thin low-warpage GPE packages were demonstrated with thickness less than 150 µm applying advanced low-cost large panel based double side carrier process. Low-loss interconnects were modeled and designed with interconnection loss below 0.12 dB at 77 GHz enabled by ultra-low loss dielectric, and high precision processing with minimal variations in line and via geometries on glass substrates. A die-package codesign is proposed for high-frequency characterization of ultra-thin GPE package for RADAR applications.
Status
- Workflow Status:Published
- Created By:Daniela Staiculescu
- Created:02/14/2020
- Modified By:Daniela Staiculescu
- Modified:02/14/2020
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