Title:  Design and Demonstration of Co-integration of Electronic and Photonic Interconnects on Glass Interposers with Single Mode Waveguides and Fiber Coupling for High Bandwidth Communications

Committee: 

Dr. Tummala, Advisor   

Dr. Bakir, Chair

Dr. Chang

Dr. Vogel

Dr. Kathaperumal

Abstract:

The objective of the proposed research is to design and demonstrate co-integration of electronic and photonic interconnects on ultra-low-loss and ultra-thin glass interposers, with single mode waveguides and fiber coupling to achieve ultra-high bandwidth communications, and coupling these optical interconnects by means of ultra-fine copper interconnects with microvias and wiring for high speed electronics. Glass as a transparent material at telecommunication wavelengths is a good candidate as clad material for single mode waveguides. In this proposal, single mode polymer waveguides on glass are designed, fabricated and characterized. The impact of different sample preparation methods on coupling loss is compared and discussed. Then a flip v-groove approach for fiber positioning and coupling is proposed and developed to provide precise fiber core to waveguide core alignment as well as to overcome the shortcomings of glass being brittle and anisotropic. Furthermore, an embedded trench method for ultra-fine copper interconnects is discussed and developed to achieve high speed electronics combined with the above proposed photonic components. Ultra-fine microvias by picosecond and femtosecond laser ablations are developed to match the smaller size of ultra-fine copper interconnects, and to push the density of microvias 16 times higher than the state of the art.