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Handbook of 3D Integration Published
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Handbook of 3D Integration was published in March 2019. This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective.
Muhannad S. Bakir, a professor in the Georgia Tech School of Electrical and Computer Engineering (ECE), was one of the book’s editors. His fellow co-editors are Paul D. Franzon, the Cirrus Logic Distinguished Professor in the Department of ECE at North Carolina State University, and Erik Jan Marinissen, principal scientist at IMEC in Leuven, Belgium and part-time visiting researcher at Eindhoven University of Technology in The Netherlands.
The first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration.
To learn more about the book, published by Wiley-VCH, visit the book’s web page.
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Summary
Handbook of 3D Integration was published in March 2019. This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective.
Muhannad S. Bakir, a professor in the Georgia Tech School of Electrical and Computer Engineering (ECE), was one of the book’s editors.
Status
- Workflow Status:Published
- Created By:Jackie Nemeth
- Created:04/24/2019
- Modified By:Jackie Nemeth
- Modified:04/24/2019
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