Ph.D. Proposal Oral Exam - Muneeb Zia

Event Details
  • Date/Time:
    • Monday November 20, 2017
      11:00 am - 1:00 pm
  • Location: Room 2100, Klaus
  • Phone:
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  • Fee(s):
    N/A
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Summaries

Summary Sentence: Technology Enablers for 2.5D and 3D Integrated RF and Biosensing Systems

Full Summary: No summary paragraph submitted.

Title:  Technology Enablers for 2.5D and 3D Integrated RF and Biosensing Systems

Committee: 

Dr. Bakir, Advisor        

Dr. Wang, Chair

Dr. Brand

Abstract:

The objective of the proposed research is to utilize mechanically flexible interconnects (MFIs) and through-silicon-vias (TSVs) as enabling technologies to 1) fabricate and characterize large-scale multi-interposer and RF systems with integrated passive inductors and 2) fabricate and characterize interconnection interface between biosensor and cellular sample allowing reuse of the biosensor. MFIs have been widely explored as I/Os enabling compensation of surface non-planarity and variations while maintaining a good electrical connection. MFIs along with TSVs, allow for temporary pressures based electrical connection that can enable modular heterogeneous 2.5D and 3D integration schemes. To this end, utilization of MFIs and TSVs as enabling technologies for heterogeneously integrated multi-interposer and RF system and a 3D integrated interconnection interface for low-cost high-throughput biosensing applications are explored.

Additional Information

In Campus Calendar
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Groups

ECE Ph.D. Proposal Oral Exams

Invited Audience
Public
Categories
Other/Miscellaneous
Keywords
Phd proposal, graduate students
Status
  • Created By: Daniela Staiculescu
  • Workflow Status: Published
  • Created On: Nov 14, 2017 - 5:16pm
  • Last Updated: Nov 14, 2017 - 5:16pm