Title:  Technology Enablers for 2.5D and 3D Integrated RF and Biosensing Systems

Committee: 

Dr. Bakir, Advisor        

Dr. Wang, Chair

Dr. Brand

Abstract:

The objective of the proposed research is to utilize mechanically flexible interconnects (MFIs) and through-silicon-vias (TSVs) as enabling technologies to 1) fabricate and characterize large-scale multi-interposer and RF systems with integrated passive inductors and 2) fabricate and characterize interconnection interface between biosensor and cellular sample allowing reuse of the biosensor. MFIs have been widely explored as I/Os enabling compensation of surface non-planarity and variations while maintaining a good electrical connection. MFIs along with TSVs, allow for temporary pressures based electrical connection that can enable modular heterogeneous 2.5D and 3D integration schemes. To this end, utilization of MFIs and TSVs as enabling technologies for heterogeneously integrated multi-interposer and RF system and a 3D integrated interconnection interface for low-cost high-throughput biosensing applications are explored.